Machine-vision guided underfill dispense system for direct chip attach electronics packages

• Main Author: Wong, Jordan How Tho.
• Other Authors: Seet, Gerald Gim Lee
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/19909
• Institution: Nanyang Technological University

The Jetski production was initiated to make pagers that contained high valued-added components. The processes of assembling the components into the pagers adopted the Direct Chip Attach or Flip Chip technique. One of the processes, known as underfill operation, was designed by the author.