Design of heat tunnel for a wire bonder

This project aims to develop a heat tunnel work-handling system for a wire bonder. The wire bonder machine is used in semiconductor industry to connect bonding pads on silicon chips to the leads on the leadframes. The design requirement of this new system is to enable bare copper leadframe to be use...

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Bibliographic Details
Main Author: Goh, Swee Leong.
Other Authors: Hsiung, Hank
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/19935
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Institution: Nanyang Technological University
Language: English

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