Development of a new material for microelectronics encapsulation

• Main Author: Koh, Loo Yee.
• Other Authors: Chian, Kerm Sin
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: http://hdl.handle.net/10356/20446
• Institution: Nanyang Technological University

This project seek to develop and characterise a new rubber-toughened moulding compound for microelectronics encapsulation purposes. The system evaluated was a poly(isocyanurate-oxazolidone) (ISOX) material with an elastomeric castor oil based polyurethane (PU) as the modifier phase. The reaction system consisted of a polyfunctional 4,4-diphenylmethane diisocyanate (PolyMDI), diglycidyl ether of bisphenol A (DGEBA), castor oil and an amine catalyst Ancamine K54. The ISOX matrix phase was formed by reacting DGEBA with PolyMDI and the rubbery PU phase from castor oil and PolyMDI. This PU phase was incorporated into the ISOX matrix through covalently bonding the two materials via various chemical reactions. The objectives of the project include studying the cure behaviour of the ISOX and PU systems and to optimise their cure conditions. The effects of varying concentration of the toughening phases on the physical, mechanical and thermal properties of the system were characterised.