Development of a new material for microelectronics encapsulation

• Main Author: Koh, Loo Yee.
• Other Authors: Chian, Kerm Sin
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: http://hdl.handle.net/10356/20446
• Institution: Nanyang Technological University

This project seek to develop and characterise a new rubber-toughened moulding compound for microelectronics encapsulation purposes. The system evaluated was a poly(isocyanurate-oxazolidone) (ISOX) material with an elastomeric castor oil based polyurethane (PU) as the modifier phase. The reaction sys...