Device design, characterization and modeling of inductors and interconnects for RFIC applications

Escalating demands for personal wireless communication equipment have spearheaded development of affordable RF System-on-Chip (SoC) solutions. Silicon is believed to be the most suitable material that can satisfy the demands of this rapidly growing wireless market. Advancements in technology have co...

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Bibliographic Details
Main Author: Sia, Choon Beng
Other Authors: Yeo Kiat Seng
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:https://hdl.handle.net/10356/20669
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Institution: Nanyang Technological University
Language: English