Design and fabrication of an improved filtered cathodic vacuum ARC (FCVA) deposition system for tetrahedral amorphous carbon (TA-C) films

Various methods and apparatus have been developed for obtaining thin films or thin coatings. Films can be deposited by physical vapour deposition techniques and chemical vapour deposition techniques. Cathodic Vacuum Arc relates to the physical techniques, and which involves the use of positive ions...

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Main Author: Tay, Beng Kang
Other Authors: School of Electrical and Electronic Engineering
Format: Research Report
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/2743
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-27432023-03-04T03:21:32Z Design and fabrication of an improved filtered cathodic vacuum ARC (FCVA) deposition system for tetrahedral amorphous carbon (TA-C) films Tay, Beng Kang School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films Various methods and apparatus have been developed for obtaining thin films or thin coatings. Films can be deposited by physical vapour deposition techniques and chemical vapour deposition techniques. Cathodic Vacuum Arc relates to the physical techniques, and which involves the use of positive ions generated from a cathodic arc source. The cathodic arc is a form of electrical discharge in vacuum, which is sustained in plasma, created by the arc alone and does not require the addition of an inert gas. 2008-09-17T09:14:06Z 2008-09-17T09:14:06Z 2001 2001 Research Report http://hdl.handle.net/10356/2743 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Tay, Beng Kang
Design and fabrication of an improved filtered cathodic vacuum ARC (FCVA) deposition system for tetrahedral amorphous carbon (TA-C) films
description Various methods and apparatus have been developed for obtaining thin films or thin coatings. Films can be deposited by physical vapour deposition techniques and chemical vapour deposition techniques. Cathodic Vacuum Arc relates to the physical techniques, and which involves the use of positive ions generated from a cathodic arc source. The cathodic arc is a form of electrical discharge in vacuum, which is sustained in plasma, created by the arc alone and does not require the addition of an inert gas.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Tay, Beng Kang
format Research Report
author Tay, Beng Kang
author_sort Tay, Beng Kang
title Design and fabrication of an improved filtered cathodic vacuum ARC (FCVA) deposition system for tetrahedral amorphous carbon (TA-C) films
title_short Design and fabrication of an improved filtered cathodic vacuum ARC (FCVA) deposition system for tetrahedral amorphous carbon (TA-C) films
title_full Design and fabrication of an improved filtered cathodic vacuum ARC (FCVA) deposition system for tetrahedral amorphous carbon (TA-C) films
title_fullStr Design and fabrication of an improved filtered cathodic vacuum ARC (FCVA) deposition system for tetrahedral amorphous carbon (TA-C) films
title_full_unstemmed Design and fabrication of an improved filtered cathodic vacuum ARC (FCVA) deposition system for tetrahedral amorphous carbon (TA-C) films
title_sort design and fabrication of an improved filtered cathodic vacuum arc (fcva) deposition system for tetrahedral amorphous carbon (ta-c) films
publishDate 2008
url http://hdl.handle.net/10356/2743
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