Investigation of via2 chain test structure high resistance failure

Investigation of via2 chain test structure high resistance failure

This report covers an investigation into the failure mechanism behind the via resistance failure in an electrical test structure. Intermittent high resistance failures occur in the via 2 chain test structure for a certain process. The failed wafers showed marginally high resistance at max 4 ohm/via...

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Main Author: Tan, Tze Han.
Other Authors: School of Electrical and Electronic Engineering
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Online Access:http://hdl.handle.net/10356/3397
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-33972023-07-04T15:21:04Z Investigation of via2 chain test structure high resistance failure Tan, Tze Han. School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics This report covers an investigation into the failure mechanism behind the via resistance failure in an electrical test structure. Intermittent high resistance failures occur in the via 2 chain test structure for a certain process. The failed wafers showed marginally high resistance at max 4 ohm/via (max specification: 1.2 ohm/via). Master of Science (Microelectronics) 2008-09-17T09:29:17Z 2008-09-17T09:29:17Z 2002 2002 Thesis http://hdl.handle.net/10356/3397 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Tan, Tze Han.
Investigation of via2 chain test structure high resistance failure
description This report covers an investigation into the failure mechanism behind the via resistance failure in an electrical test structure. Intermittent high resistance failures occur in the via 2 chain test structure for a certain process. The failed wafers showed marginally high resistance at max 4 ohm/via (max specification: 1.2 ohm/via).
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Tan, Tze Han.
format Theses and Dissertations
author Tan, Tze Han.
author_sort Tan, Tze Han.
title Investigation of via2 chain test structure high resistance failure
title_short Investigation of via2 chain test structure high resistance failure
title_full Investigation of via2 chain test structure high resistance failure
title_fullStr Investigation of via2 chain test structure high resistance failure
title_full_unstemmed Investigation of via2 chain test structure high resistance failure
title_sort investigation of via2 chain test structure high resistance failure
publishDate 2008
url http://hdl.handle.net/10356/3397
_version_ 1772825476259119104

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