Investigation of via2 chain test structure high resistance failure

• Main Author: Tan, Tze Han.
• Other Authors: School of Electrical and Electronic Engineering
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• Online Access: http://hdl.handle.net/10356/3397
• Institution: Nanyang Technological University

This report covers an investigation into the failure mechanism behind the via resistance failure in an electrical test structure. Intermittent high resistance failures occur in the via 2 chain test structure for a certain process. The failed wafers showed marginally high resistance at max 4 ohm/via...