A study on electromigration by driving force approach for submicron copper interconnect

• 主要作者: Roy, Arijit
• 其他作者: Tan Cher Ming
• 格式: Theses and Dissertations
• 出版: 2008
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
• 在線閱讀: https://hdl.handle.net/10356/3479

The prime interest of this thesis work is to investigate the physics of electromigration failure in submicron Cu interconnections including the effect of surrounding materials. A combined driving force model, including the forces from the stress and temperature gradients is presented. Experiments ar...