Investigation of cure stresses in non-conductive adhesive interconnects

187 p.

Saved in:

Bibliographic Details
Main Author:	Yu, Hong
Other Authors:	Wong Ee-Hua
Format:	Theses and Dissertations
Published:	2010
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:	https://hdl.handle.net/10356/35960
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-35960
record_format	dspace
spelling	sg-ntu-dr.10356-359602023-03-04T16:40:00Z Investigation of cure stresses in non-conductive adhesive interconnects Yu, Hong Wong Ee-Hua Zhang Xiaowu Subodh Gautam Mhaisalkar School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects 187 p. Non-conductive adhesives (NCAs) offer cost reduction, simplicity, and flexibility over other electrically conductive adhesives (ECAs) due to an absence of conductive fillers and reduced processing requirements. However, although NCAs are a very promising potential alternative to metallic solder interconnections, there continue to be significant challenges that need to be addressed for their widespread implementation. This investigation focuses on a fundamental study of the mechanical, thermal and rheological properties of NCAs during cure process, the formation of the electrical connectivity, and the mechanisms governing long-term reliability of NCA flip chip interconnects. DOCTOR OF PHILOSOPHY (MSE) 2010-04-23T02:15:04Z 2010-04-23T02:15:04Z 2007 2007 Thesis Yu,H. (2007). Investigation of cure stresses in non-conductive adhesive interconnects. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/35960 10.32657/10356/35960 application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Yu, Hong Investigation of cure stresses in non-conductive adhesive interconnects
description	187 p.
author2	Wong Ee-Hua
author_facet	Wong Ee-Hua Yu, Hong
format	Theses and Dissertations
author	Yu, Hong
author_sort	Yu, Hong
title	Investigation of cure stresses in non-conductive adhesive interconnects
title_short	Investigation of cure stresses in non-conductive adhesive interconnects
title_full	Investigation of cure stresses in non-conductive adhesive interconnects
title_fullStr	Investigation of cure stresses in non-conductive adhesive interconnects
title_full_unstemmed	Investigation of cure stresses in non-conductive adhesive interconnects
title_sort	investigation of cure stresses in non-conductive adhesive interconnects
publishDate	2010
url	https://hdl.handle.net/10356/35960
_version_	1759855469400162304

Investigation of cure stresses in non-conductive adhesive interconnects

Similar Items