Investigation of cure stresses in non-conductive adhesive interconnects

187 p.

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Bibliographic Details
Main Author: Yu, Hong
Other Authors: Wong Ee-Hua
Format: Theses and Dissertations
Published: 2010
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Online Access:https://hdl.handle.net/10356/35960
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-359602023-03-04T16:40:00Z Investigation of cure stresses in non-conductive adhesive interconnects Yu, Hong Wong Ee-Hua Zhang Xiaowu Subodh Gautam Mhaisalkar School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects 187 p. Non-conductive adhesives (NCAs) offer cost reduction, simplicity, and flexibility over other electrically conductive adhesives (ECAs) due to an absence of conductive fillers and reduced processing requirements. However, although NCAs are a very promising potential alternative to metallic solder interconnections, there continue to be significant challenges that need to be addressed for their widespread implementation. This investigation focuses on a fundamental study of the mechanical, thermal and rheological properties of NCAs during cure process, the formation of the electrical connectivity, and the mechanisms governing long-term reliability of NCA flip chip interconnects. DOCTOR OF PHILOSOPHY (MSE) 2010-04-23T02:15:04Z 2010-04-23T02:15:04Z 2007 2007 Thesis Yu,H. (2007). Investigation of cure stresses in non-conductive adhesive interconnects. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/35960 10.32657/10356/35960 application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Yu, Hong
Investigation of cure stresses in non-conductive adhesive interconnects
description 187 p.
author2 Wong Ee-Hua
author_facet Wong Ee-Hua
Yu, Hong
format Theses and Dissertations
author Yu, Hong
author_sort Yu, Hong
title Investigation of cure stresses in non-conductive adhesive interconnects
title_short Investigation of cure stresses in non-conductive adhesive interconnects
title_full Investigation of cure stresses in non-conductive adhesive interconnects
title_fullStr Investigation of cure stresses in non-conductive adhesive interconnects
title_full_unstemmed Investigation of cure stresses in non-conductive adhesive interconnects
title_sort investigation of cure stresses in non-conductive adhesive interconnects
publishDate 2010
url https://hdl.handle.net/10356/35960
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