Investigation of cure stresses in non-conductive adhesive interconnects
187 p.
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2010
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sg-ntu-dr.10356-359602023-03-04T16:40:00Z Investigation of cure stresses in non-conductive adhesive interconnects Yu, Hong Wong Ee-Hua Zhang Xiaowu Subodh Gautam Mhaisalkar School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects 187 p. Non-conductive adhesives (NCAs) offer cost reduction, simplicity, and flexibility over other electrically conductive adhesives (ECAs) due to an absence of conductive fillers and reduced processing requirements. However, although NCAs are a very promising potential alternative to metallic solder interconnections, there continue to be significant challenges that need to be addressed for their widespread implementation. This investigation focuses on a fundamental study of the mechanical, thermal and rheological properties of NCAs during cure process, the formation of the electrical connectivity, and the mechanisms governing long-term reliability of NCA flip chip interconnects. DOCTOR OF PHILOSOPHY (MSE) 2010-04-23T02:15:04Z 2010-04-23T02:15:04Z 2007 2007 Thesis Yu,H. (2007). Investigation of cure stresses in non-conductive adhesive interconnects. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/35960 10.32657/10356/35960 application/pdf |
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DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Yu, Hong Investigation of cure stresses in non-conductive adhesive interconnects |
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187 p. |
author2 |
Wong Ee-Hua |
author_facet |
Wong Ee-Hua Yu, Hong |
format |
Theses and Dissertations |
author |
Yu, Hong |
author_sort |
Yu, Hong |
title |
Investigation of cure stresses in non-conductive adhesive interconnects |
title_short |
Investigation of cure stresses in non-conductive adhesive interconnects |
title_full |
Investigation of cure stresses in non-conductive adhesive interconnects |
title_fullStr |
Investigation of cure stresses in non-conductive adhesive interconnects |
title_full_unstemmed |
Investigation of cure stresses in non-conductive adhesive interconnects |
title_sort |
investigation of cure stresses in non-conductive adhesive interconnects |
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2010 |
url |
https://hdl.handle.net/10356/35960 |
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1759855469400162304 |