Investigation of cure stresses in non-conductive adhesive interconnects

• Main Author: Yu, Hong
• Other Authors: Wong Ee-Hua
• Format: Theses and Dissertations
• Published: 2010
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: https://hdl.handle.net/10356/35960
• Institution: Nanyang Technological University

187 p.