Investigation of cure stresses in non-conductive adhesive interconnects

Investigation of cure stresses in non-conductive adhesive interconnects

187 p.

Saved in:
Bibliographic Details
Main Author: Yu, Hong
Other Authors: Wong Ee-Hua
Format: Theses and Dissertations
Published: 2010
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:https://hdl.handle.net/10356/35960
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University

Internet

https://hdl.handle.net/10356/35960

Similar Items