Etching characteristics of InxGa1-xAs and InP by inductively coupled plasma etching (ICP) technique
This thesis presents the Inductively Coupled Plasma (ICP) Etching Characteristics of InxGal-,As and InP grown by metal organic-chemical vapor deposition (MOCVD). The ICP source produces high-density plasma with ion energy and ion flux operated separately for better uniform etching on large diamet...
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sg-ntu-dr.10356-36312023-07-04T15:27:56Z Etching characteristics of InxGa1-xAs and InP by inductively coupled plasma etching (ICP) technique Vicknesh Sahmuganathan Tang, Xiaohong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials This thesis presents the Inductively Coupled Plasma (ICP) Etching Characteristics of InxGal-,As and InP grown by metal organic-chemical vapor deposition (MOCVD). The ICP source produces high-density plasma with ion energy and ion flux operated separately for better uniform etching on large diameter substrates. The studies focused on ICP etching characteristics of InxGa1-xAs and InP materials with variety of process parameters, e.g. different etch gases, gas flows, ICP power, and RIE power, etc. Effect of specific gas chemistry on the ICP etching on InxGal-xAs samples with different indium compositions 'x' and InP material has been Master of Science 2008-09-17T09:34:04Z 2008-09-17T09:34:04Z 2005 2005 Thesis http://hdl.handle.net/10356/3631 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Vicknesh Sahmuganathan Etching characteristics of InxGa1-xAs and InP by inductively coupled plasma etching (ICP) technique |
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This thesis presents the Inductively Coupled Plasma (ICP) Etching
Characteristics of InxGal-,As and InP grown by metal organic-chemical vapor
deposition (MOCVD). The ICP source produces high-density plasma with ion energy
and ion flux operated separately for better uniform etching on large diameter
substrates. The studies focused on ICP etching characteristics of InxGa1-xAs and InP
materials with variety of process parameters, e.g. different etch gases, gas flows, ICP
power, and RIE power, etc. Effect of specific gas chemistry on the ICP etching on
InxGal-xAs samples with different indium compositions 'x' and InP material has been |
author2 |
Tang, Xiaohong |
author_facet |
Tang, Xiaohong Vicknesh Sahmuganathan |
format |
Theses and Dissertations |
author |
Vicknesh Sahmuganathan |
author_sort |
Vicknesh Sahmuganathan |
title |
Etching characteristics of InxGa1-xAs and InP by inductively coupled plasma etching (ICP) technique |
title_short |
Etching characteristics of InxGa1-xAs and InP by inductively coupled plasma etching (ICP) technique |
title_full |
Etching characteristics of InxGa1-xAs and InP by inductively coupled plasma etching (ICP) technique |
title_fullStr |
Etching characteristics of InxGa1-xAs and InP by inductively coupled plasma etching (ICP) technique |
title_full_unstemmed |
Etching characteristics of InxGa1-xAs and InP by inductively coupled plasma etching (ICP) technique |
title_sort |
etching characteristics of inxga1-xas and inp by inductively coupled plasma etching (icp) technique |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/3631 |
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1772828417930035200 |