Design and development of a compact auto-molding machine

With increasing numbers of electronic equipments in the market, the integrated circuits (IC) package has become smaller in size and requires a higher number of lead for additional functions. IC encapsulation is one of the strictest processes of IC manufacturing. Molding is the process of encapsulati...

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Main Author: Wang, Xiaoyang.
Other Authors: Ling, Keck Voon
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/3696
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-36962023-07-04T15:54:14Z Design and development of a compact auto-molding machine Wang, Xiaoyang. Ling, Keck Voon School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation With increasing numbers of electronic equipments in the market, the integrated circuits (IC) package has become smaller in size and requires a higher number of lead for additional functions. IC encapsulation is one of the strictest processes of IC manufacturing. Molding is the process of encapsulating the device in plastic material. Comparing with liquid encapsulation, transfer- molding methodology is the preferred choice. Transfer molding is one of the most widely used molding processes in the semiconductor industry because of its capability to mold small parts with complex features. In this process, the molding compound is first preheated prior to its loading into the molding chamber. After pre-heating, the molding compound is forced by a plunger into the pot where it reaches melting temperature and becomes fluid. The plunger then continues to force the fluid-molding compound into the runners of the mold chase. These runners serve as canals where the fluid-molding compound travels until it reaches the cavities, which contain the lead frames for encapsulation. Master of Science (Computer Control and Automation) 2008-09-17T09:35:24Z 2008-09-17T09:35:24Z 2004 2004 Thesis http://hdl.handle.net/10356/3696 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
Wang, Xiaoyang.
Design and development of a compact auto-molding machine
description With increasing numbers of electronic equipments in the market, the integrated circuits (IC) package has become smaller in size and requires a higher number of lead for additional functions. IC encapsulation is one of the strictest processes of IC manufacturing. Molding is the process of encapsulating the device in plastic material. Comparing with liquid encapsulation, transfer- molding methodology is the preferred choice. Transfer molding is one of the most widely used molding processes in the semiconductor industry because of its capability to mold small parts with complex features. In this process, the molding compound is first preheated prior to its loading into the molding chamber. After pre-heating, the molding compound is forced by a plunger into the pot where it reaches melting temperature and becomes fluid. The plunger then continues to force the fluid-molding compound into the runners of the mold chase. These runners serve as canals where the fluid-molding compound travels until it reaches the cavities, which contain the lead frames for encapsulation.
author2 Ling, Keck Voon
author_facet Ling, Keck Voon
Wang, Xiaoyang.
format Theses and Dissertations
author Wang, Xiaoyang.
author_sort Wang, Xiaoyang.
title Design and development of a compact auto-molding machine
title_short Design and development of a compact auto-molding machine
title_full Design and development of a compact auto-molding machine
title_fullStr Design and development of a compact auto-molding machine
title_full_unstemmed Design and development of a compact auto-molding machine
title_sort design and development of a compact auto-molding machine
publishDate 2008
url http://hdl.handle.net/10356/3696
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