Design and development of a compact auto-molding machine

• Main Author: Wang, Xiaoyang.
• Other Authors: Ling, Keck Voon
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
• Online Access: http://hdl.handle.net/10356/3696
• Institution: Nanyang Technological University

With increasing numbers of electronic equipments in the market, the integrated circuits (IC) package has become smaller in size and requires a higher number of lead for additional functions. IC encapsulation is one of the strictest processes of IC manufacturing. Molding is the process of encapsulating the device in plastic material. Comparing with liquid encapsulation, transfer- molding methodology is the preferred choice. Transfer molding is one of the most widely used molding processes in the semiconductor industry because of its capability to mold small parts with complex features. In this process, the molding compound is first preheated prior to its loading into the molding chamber. After pre-heating, the molding compound is forced by a plunger into the pot where it reaches melting temperature and becomes fluid. The plunger then continues to force the fluid-molding compound into the runners of the mold chase. These runners serve as canals where the fluid-molding compound travels until it reaches the cavities, which contain the lead frames for encapsulation.