Design and development of a compact auto-molding machine

• Main Author: Wang, Xiaoyang.
• Other Authors: Ling, Keck Voon
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
• Online Access: http://hdl.handle.net/10356/3696
• Institution: Nanyang Technological University

With increasing numbers of electronic equipments in the market, the integrated circuits (IC) package has become smaller in size and requires a higher number of lead for additional functions. IC encapsulation is one of the strictest processes of IC manufacturing. Molding is the process of encapsulati...