Design and development of a compact auto-molding machine

• المؤلف الرئيسي: Wang, Xiaoyang.
• مؤلفون آخرون: Ling, Keck Voon
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/3696

With increasing numbers of electronic equipments in the market, the integrated circuits (IC) package has become smaller in size and requires a higher number of lead for additional functions. IC encapsulation is one of the strictest processes of IC manufacturing. Molding is the process of encapsulati...