Design and development of a compact auto-molding machine

• 主要作者: Wang, Xiaoyang.
• 其他作者: Ling, Keck Voon
• 格式: Theses and Dissertations
• 出版: 2008
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
• 在線閱讀: http://hdl.handle.net/10356/3696
• 機構: Nanyang Technological University

With increasing numbers of electronic equipments in the market, the integrated circuits (IC) package has become smaller in size and requires a higher number of lead for additional functions. IC encapsulation is one of the strictest processes of IC manufacturing. Molding is the process of encapsulati...