Design and development of a compact auto-molding machine

With increasing numbers of electronic equipments in the market, the integrated circuits (IC) package has become smaller in size and requires a higher number of lead for additional functions. IC encapsulation is one of the strictest processes of IC manufacturing. Molding is the process of encapsulati...

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Bibliographic Details
Main Author: Wang, Xiaoyang.
Other Authors: Ling, Keck Voon
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/3696
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Institution: Nanyang Technological University

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