Design and development of a compact auto-molding machine
With increasing numbers of electronic equipments in the market, the integrated circuits (IC) package has become smaller in size and requires a higher number of lead for additional functions. IC encapsulation is one of the strictest processes of IC manufacturing. Molding is the process of encapsulati...
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Main Author: | Wang, Xiaoyang. |
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Other Authors: | Ling, Keck Voon |
Format: | Theses and Dissertations |
Published: |
2008
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/3696 |
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Institution: | Nanyang Technological University |
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