Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)

• 主要作者: Wu, Hong Ying.
• 其他作者: Zhu, Weiguang
• 格式: Theses and Dissertations
• 出版: 2008
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
• 在線閱讀: http://hdl.handle.net/10356/3766
• 機構: Nanyang Technological University

CMP plays a very important role to realize multi-level metallization which is dependent on the ability to effectively planarize the dielectric layers, which insulate the multi-level interconnects. Despite this advantage, the process still suffer from large global non-uniformity within a die and acro...