The temperature distribution and thermal stresses induced during processing of partial SOI structures

In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented.

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Bibliographic Details
Main Author:	Chen, Junming.
Other Authors:	Tan, Cher Ming
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Online Access:	http://hdl.handle.net/10356/3771
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-3771
record_format	dspace
spelling	sg-ntu-dr.10356-37712023-07-04T16:24:01Z The temperature distribution and thermal stresses induced during processing of partial SOI structures Chen, Junming. Tan, Cher Ming School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Semiconductors In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented. Master of Engineering 2008-09-17T09:37:10Z 2008-09-17T09:37:10Z 2002 2002 Thesis http://hdl.handle.net/10356/3771 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors Chen, Junming. The temperature distribution and thermal stresses induced during processing of partial SOI structures
description	In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented.
author2	Tan, Cher Ming
author_facet	Tan, Cher Ming Chen, Junming.
format	Theses and Dissertations
author	Chen, Junming.
author_sort	Chen, Junming.
title	The temperature distribution and thermal stresses induced during processing of partial SOI structures
title_short	The temperature distribution and thermal stresses induced during processing of partial SOI structures
title_full	The temperature distribution and thermal stresses induced during processing of partial SOI structures
title_fullStr	The temperature distribution and thermal stresses induced during processing of partial SOI structures
title_full_unstemmed	The temperature distribution and thermal stresses induced during processing of partial SOI structures
title_sort	temperature distribution and thermal stresses induced during processing of partial soi structures
publishDate	2008
url	http://hdl.handle.net/10356/3771
_version_	1772827775427674112

The temperature distribution and thermal stresses induced during processing of partial SOI structures

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