The temperature distribution and thermal stresses induced during processing of partial SOI structures

• Main Author: Chen, Junming.
• Other Authors: Tan, Cher Ming
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
• Online Access: http://hdl.handle.net/10356/3771
• Institution: Nanyang Technological University

In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented.