The temperature distribution and thermal stresses induced during processing of partial SOI structures

In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented.

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Bibliographic Details
Main Author: Chen, Junming.
Other Authors: Tan, Cher Ming
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/3771
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Institution: Nanyang Technological University