Study on low temperature bonding solders for in-50 atomic % Sn/Cu joint for 3-D integrated circuit (IC)

• Main Author: Feng, Famin
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: http://hdl.handle.net/10356/38687
• Institution: Nanyang Technological University

In this project, the interaction between bi-layer eutectic In-Sn solder thin film and Cu for 3-D IC is studied. By using characterization methods such as scanning electron microscopy – energy dispersive x-ray spectroscopy (SEM-EDX) and shear test, the effects of bonding and annealing temperatures on...