Study on low temperature bonding solders for in-50 atomic % Sn/Cu joint for 3-D integrated circuit (IC)

• 主要作者: Feng, Famin
• 其他作者: Gan Chee Lip
• 格式: Final Year Project
• 語言: English
• 出版: 2010
• 主題: DRNTU::Engineering::Materials::Electronic packaging materials
• 在線閱讀: http://hdl.handle.net/10356/38687

In this project, the interaction between bi-layer eutectic In-Sn solder thin film and Cu for 3-D IC is studied. By using characterization methods such as scanning electron microscopy – energy dispersive x-ray spectroscopy (SEM-EDX) and shear test, the effects of bonding and annealing temperatures on...