Stress migration study of Cu/Low-k interconnect system

This research focuses on the stress-induced voiding in Cu interconnects. The different types, and the process and geometrical dependency of stress-induced voiding are studied. In addition, in-depth understanding of stress-induced voiding mechanisms and process; approaches to improve stress migratio...

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Bibliographic Details
Main Author:	Lim, Yeow Kheng
Other Authors:	Pey Kin Leong
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
Online Access:	https://hdl.handle.net/10356/4121
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-4121
record_format	dspace
spelling	sg-ntu-dr.10356-41212023-07-04T17:37:40Z Stress migration study of Cu/Low-k interconnect system Lim, Yeow Kheng Pey Kin Leong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic systems This research focuses on the stress-induced voiding in Cu interconnects. The different types, and the process and geometrical dependency of stress-induced voiding are studied. In addition, in-depth understanding of stress-induced voiding mechanisms and process; approaches to improve stress migration reliability and, the extendibility and impacts of the approaches to future technologies, are discussed. DOCTOR OF PHILOSOPHY (EEE) 2008-09-17T09:44:56Z 2008-09-17T09:44:56Z 2008 2008 Thesis Lim, Y. K. (2008). Stress migration study of Cu/Low-k interconnect system. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/4121 10.32657/10356/4121 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Electronic systems Lim, Yeow Kheng Stress migration study of Cu/Low-k interconnect system
description	This research focuses on the stress-induced voiding in Cu interconnects. The different types, and the process and geometrical dependency of stress-induced voiding are studied. In addition, in-depth understanding of stress-induced voiding mechanisms and process; approaches to improve stress migration reliability and, the extendibility and impacts of the approaches to future technologies, are discussed.
author2	Pey Kin Leong
author_facet	Pey Kin Leong Lim, Yeow Kheng
format	Theses and Dissertations
author	Lim, Yeow Kheng
author_sort	Lim, Yeow Kheng
title	Stress migration study of Cu/Low-k interconnect system
title_short	Stress migration study of Cu/Low-k interconnect system
title_full	Stress migration study of Cu/Low-k interconnect system
title_fullStr	Stress migration study of Cu/Low-k interconnect system
title_full_unstemmed	Stress migration study of Cu/Low-k interconnect system
title_sort	stress migration study of cu/low-k interconnect system
publishDate	2008
url	https://hdl.handle.net/10356/4121
_version_	1772825250433597440

Stress migration study of Cu/Low-k interconnect system

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