Stress migration study of Cu/Low-k interconnect system

• 主要作者: Lim, Yeow Kheng
• 其他作者: Pey Kin Leong
• 格式: Theses and Dissertations
• 出版: 2008
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
• 在線閱讀: https://hdl.handle.net/10356/4121
• 機構: Nanyang Technological University

This research focuses on the stress-induced voiding in Cu interconnects. The different types, and the process and geometrical dependency of stress-induced voiding are studied. In addition, in-depth understanding of stress-induced voiding mechanisms and process; approaches to improve stress migratio...