Stress migration study of Cu/Low-k interconnect system

• Main Author: Lim, Yeow Kheng
• Other Authors: Pey Kin Leong
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
• Online Access: https://hdl.handle.net/10356/4121
• Institution: Nanyang Technological University

This research focuses on the stress-induced voiding in Cu interconnects. The different types, and the process and geometrical dependency of stress-induced voiding are studied. In addition, in-depth understanding of stress-induced voiding mechanisms and process; approaches to improve stress migratio...