Study of VIA-related failures in sub-micron technologies

An investigation into the Back-end of Line (BEOL) Via Related failures is presented in this report. It documents the various process issues seen and the optimization carried out in the BEOL scheme that helps to tackle this issue. The thought process and the experimental results are also highlighted.

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Main Author: Chia, Gary Yue Choy.
Other Authors: Goh, Wang Ling
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/4139
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-41392023-07-04T16:37:55Z Study of VIA-related failures in sub-micron technologies Chia, Gary Yue Choy. Goh, Wang Ling School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics An investigation into the Back-end of Line (BEOL) Via Related failures is presented in this report. It documents the various process issues seen and the optimization carried out in the BEOL scheme that helps to tackle this issue. The thought process and the experimental results are also highlighted. Master of Science (Microelectronics) 2008-09-17T09:45:16Z 2008-09-17T09:45:16Z 2003 2003 Thesis http://hdl.handle.net/10356/4139 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Chia, Gary Yue Choy.
Study of VIA-related failures in sub-micron technologies
description An investigation into the Back-end of Line (BEOL) Via Related failures is presented in this report. It documents the various process issues seen and the optimization carried out in the BEOL scheme that helps to tackle this issue. The thought process and the experimental results are also highlighted.
author2 Goh, Wang Ling
author_facet Goh, Wang Ling
Chia, Gary Yue Choy.
format Theses and Dissertations
author Chia, Gary Yue Choy.
author_sort Chia, Gary Yue Choy.
title Study of VIA-related failures in sub-micron technologies
title_short Study of VIA-related failures in sub-micron technologies
title_full Study of VIA-related failures in sub-micron technologies
title_fullStr Study of VIA-related failures in sub-micron technologies
title_full_unstemmed Study of VIA-related failures in sub-micron technologies
title_sort study of via-related failures in sub-micron technologies
publishDate 2008
url http://hdl.handle.net/10356/4139
_version_ 1772827037624434688