Study of VIA-related failures in sub-micron technologies
An investigation into the Back-end of Line (BEOL) Via Related failures is presented in this report. It documents the various process issues seen and the optimization carried out in the BEOL scheme that helps to tackle this issue. The thought process and the experimental results are also highlighted.
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sg-ntu-dr.10356-41392023-07-04T16:37:55Z Study of VIA-related failures in sub-micron technologies Chia, Gary Yue Choy. Goh, Wang Ling School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics An investigation into the Back-end of Line (BEOL) Via Related failures is presented in this report. It documents the various process issues seen and the optimization carried out in the BEOL scheme that helps to tackle this issue. The thought process and the experimental results are also highlighted. Master of Science (Microelectronics) 2008-09-17T09:45:16Z 2008-09-17T09:45:16Z 2003 2003 Thesis http://hdl.handle.net/10356/4139 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Chia, Gary Yue Choy. Study of VIA-related failures in sub-micron technologies |
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An investigation into the Back-end of Line (BEOL) Via Related failures is presented in this report. It documents the various process issues seen and the optimization carried out in the BEOL scheme that helps to tackle this issue. The thought process and the experimental results are also highlighted. |
author2 |
Goh, Wang Ling |
author_facet |
Goh, Wang Ling Chia, Gary Yue Choy. |
format |
Theses and Dissertations |
author |
Chia, Gary Yue Choy. |
author_sort |
Chia, Gary Yue Choy. |
title |
Study of VIA-related failures in sub-micron technologies |
title_short |
Study of VIA-related failures in sub-micron technologies |
title_full |
Study of VIA-related failures in sub-micron technologies |
title_fullStr |
Study of VIA-related failures in sub-micron technologies |
title_full_unstemmed |
Study of VIA-related failures in sub-micron technologies |
title_sort |
study of via-related failures in sub-micron technologies |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/4139 |
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1772827037624434688 |