Study of VIA-related failures in sub-micron technologies
An investigation into the Back-end of Line (BEOL) Via Related failures is presented in this report. It documents the various process issues seen and the optimization carried out in the BEOL scheme that helps to tackle this issue. The thought process and the experimental results are also highlighted.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/4139 |
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| Institution: | Nanyang Technological University |
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