Investigation of low temperature wafer bonding using intermediate layer

In this project, the sol-gel intermediate layer bonding is demonstrated to provide high bond strength at low temperature (such as 100 degree celsius).

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Bibliographic Details
Main Author:	Deng, Shusheng
Other Authors:	Tan, Cher Ming
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Online Access:	http://hdl.handle.net/10356/4209
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-4209
record_format	dspace
spelling	sg-ntu-dr.10356-42092023-07-04T15:09:57Z Investigation of low temperature wafer bonding using intermediate layer Deng, Shusheng Tan, Cher Ming School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Semiconductors In this project, the sol-gel intermediate layer bonding is demonstrated to provide high bond strength at low temperature (such as 100 degree celsius). Master of Engineering 2008-09-17T09:46:43Z 2008-09-17T09:46:43Z 2004 2004 Thesis http://hdl.handle.net/10356/4209 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors Deng, Shusheng Investigation of low temperature wafer bonding using intermediate layer
description	In this project, the sol-gel intermediate layer bonding is demonstrated to provide high bond strength at low temperature (such as 100 degree celsius).
author2	Tan, Cher Ming
author_facet	Tan, Cher Ming Deng, Shusheng
format	Theses and Dissertations
author	Deng, Shusheng
author_sort	Deng, Shusheng
title	Investigation of low temperature wafer bonding using intermediate layer
title_short	Investigation of low temperature wafer bonding using intermediate layer
title_full	Investigation of low temperature wafer bonding using intermediate layer
title_fullStr	Investigation of low temperature wafer bonding using intermediate layer
title_full_unstemmed	Investigation of low temperature wafer bonding using intermediate layer
title_sort	investigation of low temperature wafer bonding using intermediate layer
publishDate	2008
url	http://hdl.handle.net/10356/4209
_version_	1772829009761009664

Investigation of low temperature wafer bonding using intermediate layer

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