Investigation of low temperature wafer bonding using intermediate layer
In this project, the sol-gel intermediate layer bonding is demonstrated to provide high bond strength at low temperature (such as 100 degree celsius).
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| 格式: | Theses and Dissertations |
| 出版: |
2008
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/4209 |
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