FE simulation of thin film mechanical sensitivity for MEMS applications

• Main Author: Zhang, Xin Gang
• Other Authors: Lin Rongming
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/42866
• Institution: Nanyang Technological University

In this report, the use of corrugated diaphragm for microphone sensing is discussed. The corrugated diaphragm is a type of thin film MEMS device that is actuated by an external pressure. The diaphragm’s height is studied in this project to determine the optimum mechanical sensitivity, natural frequency and initial stress loading. The use of ANSYS Finite Element Analysis software is to obtain the necessary values for study instead of actual experiment which is costly and time consuming. The content of this report on ANSYS application, such as modeling and simulation, including detailed procedures taken to obtain the necessary results serves to provide a guide for further research to be carried out. Finally, the comparisons were made between six case studies and the chosen design is concluded based on the criterion of microphone sensing.