Measurement of stress evolution in pulse-reverse electrochemical deposition using Micro-Raman Spectroscopy

• المؤلف الرئيسي: Yang, Qi Hua
• مؤلفون آخرون: Miao Jianmin
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2011
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/45821

Nowadays, copper deposit is extensively used in microelectronic applications, because the electroplated copper exhibits excellent electrical conductivity along with high hardness. in the resent literature, it is known that copper electroplated with pulse reverse current produces larger hardness than...