NDT of adhesively bonded structure based on the impedance method

171 p.

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Bibliographic Details
Main Authors:	Lim, Mong King, Liew, Kim Meow, Low, Seow Chay, Wong, Brian Stephen, Jiang Li, Tui, Chen Guan
Other Authors:	School of Mechanical and Production Engineering
Format:	Research Report
Published:	2011
Subjects:	DRNTU::Engineering::Aeronautical engineering
Online Access:	http://hdl.handle.net/10356/46635
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-46635
record_format	dspace
spelling	sg-ntu-dr.10356-466352023-03-04T18:07:50Z NDT of adhesively bonded structure based on the impedance method Lim, Mong King Liew, Kim Meow Low, Seow Chay Wong, Brian Stephen Jiang Li Tui, Chen Guan School of Mechanical and Production Engineering DRNTU::Engineering::Aeronautical engineering 171 p. The use of the mechanical impedance method for non-destructive testing and analysis of honeycomb structures is described in this study. Mechanical impedance instruments, MIA 3000, Versiscan and VP 200, were used to study the detachment of honeycomb structures on specimens which were made of two layers of thin aluminium skins with Nomex honeycomb cores. RP 38/91 2011-12-21T03:12:49Z 2011-12-21T03:12:49Z 1994 1994 Research Report http://hdl.handle.net/10356/46635 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Aeronautical engineering
spellingShingle	DRNTU::Engineering::Aeronautical engineering Lim, Mong King Liew, Kim Meow Low, Seow Chay Wong, Brian Stephen Jiang Li Tui, Chen Guan NDT of adhesively bonded structure based on the impedance method
description	171 p.
author2	School of Mechanical and Production Engineering
author_facet	School of Mechanical and Production Engineering Lim, Mong King Liew, Kim Meow Low, Seow Chay Wong, Brian Stephen Jiang Li Tui, Chen Guan
format	Research Report
author	Lim, Mong King Liew, Kim Meow Low, Seow Chay Wong, Brian Stephen Jiang Li Tui, Chen Guan
author_sort	Lim, Mong King
title	NDT of adhesively bonded structure based on the impedance method
title_short	NDT of adhesively bonded structure based on the impedance method
title_full	NDT of adhesively bonded structure based on the impedance method
title_fullStr	NDT of adhesively bonded structure based on the impedance method
title_full_unstemmed	NDT of adhesively bonded structure based on the impedance method
title_sort	ndt of adhesively bonded structure based on the impedance method
publishDate	2011
url	http://hdl.handle.net/10356/46635
_version_	1759855597222625280

NDT of adhesively bonded structure based on the impedance method

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