NDT of adhesively bonded structure based on the impedance method
171 p.
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Main Authors: | Lim, Mong King, Liew, Kim Meow, Low, Seow Chay, Wong, Brian Stephen, Jiang Li, Tui, Chen Guan |
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Other Authors: | School of Mechanical and Production Engineering |
Format: | Research Report |
Published: |
2011
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/46635 |
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Institution: | Nanyang Technological University |
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