NDT of adhesively bonded structure based on the impedance method

• Main Authors: Lim, Mong King, Liew, Kim Meow, Low, Seow Chay, Wong, Brian Stephen, Jiang Li, Tui, Chen Guan
• Other Authors: School of Mechanical and Production Engineering
• Format: Research Report
• Published: 2011
• Subjects: DRNTU::Engineering::Aeronautical engineering
• Online Access: http://hdl.handle.net/10356/46635
• Institution: Nanyang Technological University

171 p.