High frequency measurement of dielectric properties for packaging materials
This thesis summarizes the purpose and milestones covered in the process of carrying out the project. Essentially, the project proposes to develop and implement a suitable method to measure the complex permittivity of thin (l-3mm) packaging materials used in the microelectronics industry. Apart from...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | https://hdl.handle.net/10356/4699 |
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| Institution: | Nanyang Technological University |
| Summary: | This thesis summarizes the purpose and milestones covered in the process of carrying out the project. Essentially, the project proposes to develop and implement a suitable method to measure the complex permittivity of thin (l-3mm) packaging materials used in the microelectronics industry. Apart from being able to measure over a large bandwidth from 0.1 -20 GHz and be relatively low cost and easy to implement, the technique also has to be reasonably accurate as compared to other available methods. |
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