High frequency measurement of dielectric properties for packaging materials

This thesis summarizes the purpose and milestones covered in the process of carrying out the project. Essentially, the project proposes to develop and implement a suitable method to measure the complex permittivity of thin (l-3mm) packaging materials used in the microelectronics industry. Apart from...

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Main Author: Lim, Ying Ying
Other Authors: Mihai Dragos Rotaru
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/4699
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-46992023-07-04T16:56:36Z High frequency measurement of dielectric properties for packaging materials Lim, Ying Ying Mihai Dragos Rotaru Arokiaswami Alphones School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging This thesis summarizes the purpose and milestones covered in the process of carrying out the project. Essentially, the project proposes to develop and implement a suitable method to measure the complex permittivity of thin (l-3mm) packaging materials used in the microelectronics industry. Apart from being able to measure over a large bandwidth from 0.1 -20 GHz and be relatively low cost and easy to implement, the technique also has to be reasonably accurate as compared to other available methods. MASTER OF ENGINEERING (EEE) 2008-09-17T09:56:54Z 2008-09-17T09:56:54Z 2005 2005 Thesis Lim, Y. Y. (2005). High frequency measurement of dielectric properties for packaging materials. Master’s thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/4699 10.32657/10356/4699 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Lim, Ying Ying
High frequency measurement of dielectric properties for packaging materials
description This thesis summarizes the purpose and milestones covered in the process of carrying out the project. Essentially, the project proposes to develop and implement a suitable method to measure the complex permittivity of thin (l-3mm) packaging materials used in the microelectronics industry. Apart from being able to measure over a large bandwidth from 0.1 -20 GHz and be relatively low cost and easy to implement, the technique also has to be reasonably accurate as compared to other available methods.
author2 Mihai Dragos Rotaru
author_facet Mihai Dragos Rotaru
Lim, Ying Ying
format Theses and Dissertations
author Lim, Ying Ying
author_sort Lim, Ying Ying
title High frequency measurement of dielectric properties for packaging materials
title_short High frequency measurement of dielectric properties for packaging materials
title_full High frequency measurement of dielectric properties for packaging materials
title_fullStr High frequency measurement of dielectric properties for packaging materials
title_full_unstemmed High frequency measurement of dielectric properties for packaging materials
title_sort high frequency measurement of dielectric properties for packaging materials
publishDate 2008
url https://hdl.handle.net/10356/4699
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