Modelling of a mems microphone using wafer bonding technology

111 p.

Saved in:
Bibliographic Details
Main Author: Tan, Chee Wee.
Other Authors: Miao Jianmin
Format: Theses and Dissertations
Published: 2011
Subjects:
Online Access:http://hdl.handle.net/10356/47130
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
id sg-ntu-dr.10356-47130
record_format dspace
spelling sg-ntu-dr.10356-471302023-03-11T17:29:22Z Modelling of a mems microphone using wafer bonding technology Tan, Chee Wee. Miao Jianmin School of Mechanical and Production Engineering DRNTU::Engineering 111 p. This dissertation report presents the mathematical modelling of a MEMS capacitive technology microphone that is designed and fabricated based on the advanced wafer bonding technology. A silicon diaphragm and a rigid silicon backplate perforated with acoustic holes constitute the two electrodes of the microphone. The design considerations and specifications of a condenser microphone are briefly presented and discussed. A reliable bulk micro-machining fabrication process for silicon microphones with sensitivity trimming has been proposed and developed. The bonding between the diaphragm and the backplate wafers is accomplished by the application of an Au-Si eutectic bonding technique. The advent of micro-machining technology has inevitably empowered the manufacture of highly sensitive and miniaturized small-signal sensors. However, its inherent small size contributes to a particular class of mechanical noise, which is known as mechanical-thermal noise, as a result of molecular thermal agitation. This mechanical-thermal noise, together with other sources of background noise, establishes the lowest limit of acoustic pressure that can be picked up by the microphone. Verification of a written MATLAB program is performed against three B & K. microphones and the simulated microphone parameters are in good agreement with those values that are cited in established literatures. Master of Science (Precision Engineering) 2011-12-27T06:27:43Z 2011-12-27T06:27:43Z 2004 2004 Thesis http://hdl.handle.net/10356/47130 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering
spellingShingle DRNTU::Engineering
Tan, Chee Wee.
Modelling of a mems microphone using wafer bonding technology
description 111 p.
author2 Miao Jianmin
author_facet Miao Jianmin
Tan, Chee Wee.
format Theses and Dissertations
author Tan, Chee Wee.
author_sort Tan, Chee Wee.
title Modelling of a mems microphone using wafer bonding technology
title_short Modelling of a mems microphone using wafer bonding technology
title_full Modelling of a mems microphone using wafer bonding technology
title_fullStr Modelling of a mems microphone using wafer bonding technology
title_full_unstemmed Modelling of a mems microphone using wafer bonding technology
title_sort modelling of a mems microphone using wafer bonding technology
publishDate 2011
url http://hdl.handle.net/10356/47130
_version_ 1761781402213285888