Low temperature thermocompression bonding of copper-copper bumps using gold alloy nanoparticles

• Main Author: Tan, Shi Liang.
• Other Authors: Wong Chee Cheong
• Format: Final Year Project
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials; DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: http://hdl.handle.net/10356/48405
• Institution: Nanyang Technological University

One of the key methods to form interconnects between electrical packages and devices is by thermocompression bonding. The reliability of these metallic interconnects are often dictated by bonding parameters like temperature, time and pressure. Copper (Cu) which possesses outstanding mechanical, elec...