Finite element modeling of failure in a bond layer

• Main Author: Tan, Hou Soon.
• Other Authors: Pang Hock Lye, John
• Format: Final Year Project
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/49594
• Institution: Nanyang Technological University

Technology advancement in the electronic and electrical industry has been a crucial factor in the development and enhancement of the modern living standard. Highly-intelligent electronic products were introduced to establish the connection with the power of Information Technologies (IT). The investi...