Finite element modeling of failure in a bond layer

• 主要作者: Tan, Hou Soon.
• 其他作者: Pang Hock Lye, John
• 格式: Final Year Project
• 語言: English
• 出版: 2012
• 主題: DRNTU::Engineering::Mechanical engineering
• 在線閱讀: http://hdl.handle.net/10356/49594
• 機構: Nanyang Technological University

Technology advancement in the electronic and electrical industry has been a crucial factor in the development and enhancement of the modern living standard. Highly-intelligent electronic products were introduced to establish the connection with the power of Information Technologies (IT). The investi...