Finite element modeling of failure in a bond layer

Technology advancement in the electronic and electrical industry has been a crucial factor in the development and enhancement of the modern living standard. Highly-intelligent electronic products were introduced to establish the connection with the power of Information Technologies (IT). The investi...

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Main Author: Tan, Hou Soon.
Other Authors: Pang Hock Lye, John
Format: Final Year Project
Language:English
Published: 2012
Subjects:
Online Access:http://hdl.handle.net/10356/49594
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-495942023-03-04T18:20:46Z Finite element modeling of failure in a bond layer Tan, Hou Soon. Pang Hock Lye, John School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering Technology advancement in the electronic and electrical industry has been a crucial factor in the development and enhancement of the modern living standard. Highly-intelligent electronic products were introduced to establish the connection with the power of Information Technologies (IT). The investigation on the mechanical properties of the fundamental components in a common electronic product became crucial and, thus, the solder joint will be studied for its strength that determines the durability and functionality of the product. In this report, the mechanical properties and material behaviors of Sn-3.8Ag-0.7Cu (SAC387) solder specimens were tested and discussed for a range of geometrical ratios and strain rates at room temperature. For the first experiment, the copper rod specimens were machined and soldered with the desired SAC387 based on their specified geometrical ratio and then tested with an uni-axial load at a constant strain rate of 0.01s-1. Comparisons were firstly conducted between the experimental and theoretically calculated results based on Orowan’s Approximation Equation. Then, the experimental results were also compared against the Finite Element Analysis (FEA) simulation results. Based on the experiment, it was observed that variation of the geometrical ratio induced the formation of the dimensional constraining effect within the material, which resulted in the linear relationship towards the Ultimate Tensile Strength (UTS) of the SAC387. Within the geometrical ratio, it was also studied that the variation in the thickness of the joint had caused higher influence towards the UTS of the SAC387 as compared to varying the diametric dimension. Bachelor of Engineering (Mechanical Engineering) 2012-05-22T04:01:37Z 2012-05-22T04:01:37Z 2012 2012 Final Year Project (FYP) http://hdl.handle.net/10356/49594 en Nanyang Technological University 114 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Mechanical engineering
spellingShingle DRNTU::Engineering::Mechanical engineering
Tan, Hou Soon.
Finite element modeling of failure in a bond layer
description Technology advancement in the electronic and electrical industry has been a crucial factor in the development and enhancement of the modern living standard. Highly-intelligent electronic products were introduced to establish the connection with the power of Information Technologies (IT). The investigation on the mechanical properties of the fundamental components in a common electronic product became crucial and, thus, the solder joint will be studied for its strength that determines the durability and functionality of the product. In this report, the mechanical properties and material behaviors of Sn-3.8Ag-0.7Cu (SAC387) solder specimens were tested and discussed for a range of geometrical ratios and strain rates at room temperature. For the first experiment, the copper rod specimens were machined and soldered with the desired SAC387 based on their specified geometrical ratio and then tested with an uni-axial load at a constant strain rate of 0.01s-1. Comparisons were firstly conducted between the experimental and theoretically calculated results based on Orowan’s Approximation Equation. Then, the experimental results were also compared against the Finite Element Analysis (FEA) simulation results. Based on the experiment, it was observed that variation of the geometrical ratio induced the formation of the dimensional constraining effect within the material, which resulted in the linear relationship towards the Ultimate Tensile Strength (UTS) of the SAC387. Within the geometrical ratio, it was also studied that the variation in the thickness of the joint had caused higher influence towards the UTS of the SAC387 as compared to varying the diametric dimension.
author2 Pang Hock Lye, John
author_facet Pang Hock Lye, John
Tan, Hou Soon.
format Final Year Project
author Tan, Hou Soon.
author_sort Tan, Hou Soon.
title Finite element modeling of failure in a bond layer
title_short Finite element modeling of failure in a bond layer
title_full Finite element modeling of failure in a bond layer
title_fullStr Finite element modeling of failure in a bond layer
title_full_unstemmed Finite element modeling of failure in a bond layer
title_sort finite element modeling of failure in a bond layer
publishDate 2012
url http://hdl.handle.net/10356/49594
_version_ 1759853775628009472