Finite element modeling of failure in a bond layer

• المؤلف الرئيسي: Tan, Hou Soon.
• مؤلفون آخرون: Pang Hock Lye, John
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Mechanical engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/49594
• المؤسسة: Nanyang Technological University

Technology advancement in the electronic and electrical industry has been a crucial factor in the development and enhancement of the modern living standard. Highly-intelligent electronic products were introduced to establish the connection with the power of Information Technologies (IT). The investi...