Scanning methodology
Illustrate the various sampling strategy used in different phase of a product cycle, comparing two types of inspection tools and presenting three case studies to illustrate the importance of early detection. The impact of defects towards wafer yield will also be addressed.
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2008
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Online Access: | http://hdl.handle.net/10356/5004 |
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sg-ntu-dr.10356-50042023-07-04T15:09:00Z Scanning methodology Ong, Lay Ting. Prasad, Krishnamachar School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic systems Illustrate the various sampling strategy used in different phase of a product cycle, comparing two types of inspection tools and presenting three case studies to illustrate the importance of early detection. The impact of defects towards wafer yield will also be addressed. Master of Science (Microelectronics) 2008-09-17T10:03:05Z 2008-09-17T10:03:05Z 2004 2004 Thesis http://hdl.handle.net/10356/5004 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Electrical and electronic engineering::Electronic systems Ong, Lay Ting. Scanning methodology |
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Illustrate the various sampling strategy used in different phase of a product cycle, comparing two types of inspection tools and presenting three case studies to illustrate the importance of early detection. The impact of defects towards wafer yield will also be addressed. |
author2 |
Prasad, Krishnamachar |
author_facet |
Prasad, Krishnamachar Ong, Lay Ting. |
format |
Theses and Dissertations |
author |
Ong, Lay Ting. |
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Ong, Lay Ting. |
title |
Scanning methodology |
title_short |
Scanning methodology |
title_full |
Scanning methodology |
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Scanning methodology |
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Scanning methodology |
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scanning methodology |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/5004 |
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1772828539436924928 |