Scanning methodology
Illustrate the various sampling strategy used in different phase of a product cycle, comparing two types of inspection tools and presenting three case studies to illustrate the importance of early detection. The impact of defects towards wafer yield will also be addressed.
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Main Author: | Ong, Lay Ting. |
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Other Authors: | Prasad, Krishnamachar |
Format: | Theses and Dissertations |
Published: |
2008
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/5004 |
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Institution: | Nanyang Technological University |
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