Scanning methodology

Illustrate the various sampling strategy used in different phase of a product cycle, comparing two types of inspection tools and presenting three case studies to illustrate the importance of early detection. The impact of defects towards wafer yield will also be addressed.

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Bibliographic Details
Main Author: Ong, Lay Ting.
Other Authors: Prasad, Krishnamachar
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5004
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Institution: Nanyang Technological University
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