Physical analysis of semiconductors materials and devices

• Main Author: Aung, Myo Sint
• Other Authors: Yoon Soon Fatt
• Format: Final Year Project
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
• Online Access: http://hdl.handle.net/10356/50264
• Institution: Nanyang Technological University

This project concerns the measurements and characterization of GaAs/Si direct wafer bonding and devices using optical and electrical methods. The limitations that lie within GaAs/Si direct wafer bonding will be identified and given improvised solutions. Dry plasma treatment is used before bonding of...