Back-end-of-line process reliability of advanced semiconductor technology

• المؤلف الرئيسي: Park, Hun Sub.
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: Research Report
• اللغة: English
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/5036

The main objectives of this project are (1) to establish new test procedures for accurate wafer-level characterization of Cu electromigration behavior and low-k dielectric materials, (2) to measure the wafer-level Cu electromigration characteristics and explain them in terms of microstructural chang...