Back-end-of-line process reliability of advanced semiconductor technology
The main objectives of this project are (1) to establish new test procedures for accurate wafer-level characterization of Cu electromigration behavior and low-k dielectric materials, (2) to measure the wafer-level Cu electromigration characteristics and explain them in terms of microstructural chang...
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Main Author: | Park, Hun Sub. |
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Other Authors: | School of Materials Science & Engineering |
Format: | Research Report |
Language: | English |
Published: |
2008
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/5036 |
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Institution: | Nanyang Technological University |
Language: | English |
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