Back-end-of-line process reliability of advanced semiconductor technology

The main objectives of this project are (1) to establish new test procedures for accurate wafer-level characterization of Cu electromigration behavior and low-k dielectric materials, (2) to measure the wafer-level Cu electromigration characteristics and explain them in terms of microstructural chang...

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書目詳細資料
主要作者: Park, Hun Sub.
其他作者: School of Materials Science & Engineering
格式: Research Report
語言:English
出版: 2008
主題:
在線閱讀:http://hdl.handle.net/10356/5036
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